BLM9D2327-25B
Download datasheet This product has been discontinued.Click here for discontinuation information.
BLM9D2327-25B
Download datasheet
This product has been discontinued.
Click here for discontinuation information.
The replacement is: BLM9D2327-26B
The replacement is: BLM9D2327-26B
LDMOS 2-stage integrated Doherty MMIC
The BLM9D2327-25B is a 2-stage fully integrated Doherty MMIC solution using Ampleon's state of the art GEN9 LDMOS technology. The carrier and peaking device, input splitter and output combiner are integrated in a single package. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 2300 MHz to 2700 MHz. Available in PQFN outline.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- High efficiency
- Designed for broadband operation (frequency 2300 MHz to 2700 MHz)
- Independent control of carrier and peaking bias
- Integrated ESD protection
- Source impedance 50 Ω; high power gain
- Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
Applications
- RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base stations in the 2300 MHz to 2700 MHz frequency range.
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2300 | 2700 | MHz | ||
| PL(3dB) | nominal output power at 3 dB gain compression | 25 | W | |||
| Test signal: 1-c LTE 20 MHz | ||||||
| VDS | drain-source voltage | 2500 MHz [0] | 28 | V | ||
| Gp | power gain | 2500 MHz [0] | 28.5 | dB | ||
| ηD | drain efficiency | 2500 MHz [0] | 40.3 | % | ||
| PL(AV) | average output power | 2500 MHz [0] | 4.9 | W | ||
Package / Packing
All type numbers in the table below are discontinued.
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM9D2327-25B | PQFN20 (SOT1462-1) |
sot1462-1_po | Reel 7" Q1/T1 in Drypack | Withdrawn | Standard Marking |
BLM9D2327-25BZ (9349 600 73515) |
|
| T&R Drypack | Withdrawn | Standard Marking |
BLM9D2327-25BX (9349 600 73525) |
Discontinuation information
| Type number | Ordering code (12NC) | Last-time buy date | Last-time delivery date | Replacement product | DN Notice | Status | Comments |
|---|---|---|---|---|---|---|---|
| BLM9D2327-25B | 9349 600 73515 | 2021-12-31 | 2022-09-30 | BLM9D2327-26B | 202103001DN | Full Withdrawal | |
| BLM9D2327-25B | 9349 600 73525 | 2021-12-31 | 2022-09-30 | BLM9D2327-26B | 202103001DN | Full Withdrawal |
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | n.c. | not connected |
|
|
| 2 | n.c. | not connected | ||
| 3 | n.c. | not connected | ||
| 4 | n.c. | not connected | ||
| 5 | VDS1 | drain-source voltage of driver stages | ||
| 6 | VGS(peak) | gate-source voltage of peaking | ||
| 7 | VGS(carr) | gate-source voltage of carrier | ||
| 8 | RF_IN | RF input | ||
| 9 | VGS(carr) | gate-source voltage of carrier | ||
| 10 | VGS(peak) | gate-source voltage of peaking | ||
| 11 | VDS1 | drain-source voltage of driver stages | ||
| 12 | n.c. | not connected | ||
| 13 | n.c. | not connected | ||
| 14 | n.c. | not connected | ||
| 15 | n.c. | not connected | ||
| 16 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| 17 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| 18 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| 19 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| 20 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| flange | GND | RF ground |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
| LDMOS 2-stage integrated Doherty MMIC | Data sheet | 2017-09-01 | |
| Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
| Packages for RF power transistors | Leaflet | 2024-10-25 | |
| LDMOS ruggedness reliability | Other type | 2017-03-28 | |
| Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
| LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
| RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLM9D2327-25B (Data sheet) | Design support | 2017-10-05 |