BLM9D2325-20AB
Download datasheet This product has been discontinued.Click here for discontinuation information.
BLM9D2325-20AB
Download datasheet
This product has been discontinued.
Click here for discontinuation information.
The replacement is: BLM9D2327-26B
The replacement is: BLM9D2327-26B
LDMOS 2-stage integrated Doherty MMIC
The BLM9D2325-20AB is a 2-stage fully integrated Doherty MMIC solution using Ampleon's state of the art GEN9 LDMOS technology. The carrier and peaking device, input splitter and output combiner are integrated in a single package. This multiband device is perfectly suited as a final device in massive MIMO or small cell applications in the frequency range from 2300 MHz to 2500 MHz. Available in PQFN outline.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- Very high efficiency thanks to asymmetry
- Designed for broadband operation (frequency 2300 MHz to 2500 MHz)
- Independent control of carrier and peaking bias
- Integrated ESD protection
- Excellent thermal stability
- Source impedance 50 Ω; high power gain
- Compliant to Directive 2002/95/EC, regarding restriction of hazardous substances (RoHS)
Applications
- RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base stations in the 2300 MHz to 2500 MHz frequency range.
Parametrics
Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
---|---|---|---|---|---|---|
frange | frequency range | 2300 | 2500 | MHz | ||
PL(3dB) | nominal output power at 3 dB gain compression | 20 | W | |||
Test signal: 1-c W-CDMA | ||||||
VDS | drain-source voltage | 2350 MHz [0] | 28 | V | ||
Gp | power gain | 2350 MHz [0] | 27.1 | dB | ||
ηD | drain efficiency | 2350 MHz [0] | 42.1 | % | ||
PL(AV) | average output power | 2350 MHz [0] | 3.55 | W | ||
ACPR5M | adjacent channel power ratio (5 MHz) | 2350 MHz [0] | -36.3 | dBc |
Package / Packing
All type numbers in the table below are discontinued.
Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
BLM9D2325-20AB | PQFN20 (SOT1462-1) |
sot1462-1_po | Reel 7" Q1/T1 in Drypack | Withdrawn | Standard Marking |
BLM9D2325-20ABZ (9349 600 87515) |
|
T&R Drypack | Withdrawn | Standard Marking |
BLM9D2325-20ABX (9349 600 87525) |
Discontinuation information
Type number | Ordering code (12NC) | Last-time buy date | Last-time delivery date | Replacement product | DN Notice | Status | Comments |
---|---|---|---|---|---|---|---|
BLM9D2325-20AB | 9349 600 87515 | 2021-12-31 | 2022-09-30 | BLM9D2327-26B | 202103001DN | Full Withdrawal | |
BLM9D2325-20AB | 9349 600 87525 | 2021-12-31 | 2022-09-30 | BLM9D2327-26B | 202103001DN | Full Withdrawal |
Pinning info
Pin | Symbol | Description | Simplified outline | Graphic symbol |
---|---|---|---|---|
1 | n.c. | not connected | ||
2 | n.c. | not connected | ||
3 | n.c. | not connected | ||
4 | n.c. | not connected | ||
5 | VDS1 | drain-source voltage of driver stages | ||
6 | VGS(peak) | gate-source voltage of peaking | ||
7 | VGS(carr) | gate-source voltage of carrier | ||
8 | RF_IN | RF input | ||
9 | VGS(carr) | gate-source voltage of carrier | ||
10 | VGS(peak) | gate-source voltage of peaking | ||
11 | VDS1 | drain-source voltage of driver stages | ||
12 | n.c. | not connected | ||
13 | n.c. | not connected | ||
14 | n.c. | not connected | ||
15 | n.c. | not connected | ||
16 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
17 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
18 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
19 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
20 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
flange | GND | RF ground |
Documentation
Title | Type | Date | |
---|---|---|---|
Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
LDMOS 2-stage integrated Doherty MMIC | Data sheet | 2017-07-24 | |
Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
Packages for RF power transistors | Leaflet | 2024-10-25 | |
LDMOS ruggedness reliability | Other type | 2017-03-28 | |
Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
Title | Type | Date | |
---|---|---|---|
Printed-Circuit Board (PCB) BLM9D2325-20AB (Data sheet) | Design support | 2018-08-20 |