BLM10D2327-60ABG
Download datasheetBLM10D2327-60ABG
Download datasheetLDMOS 2-stage integrated Doherty MMIC
The BLM10D2327-60ABG is a 2-stage fully integrated Doherty MMIC solution using Ampleon’s state of the art GEN10 LDMOS MMIC technology. The carrier and peaking device, input splitter and output combiner are integrated in a single package. This device is perfectly suited as general purpose driver or mMIMO final in the frequency range from 2300 MHz to 2700 MHz. Available in gull wing.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- High efficiency
- High output impedance thanks to integrated pre-match
- Designed for wideband operation (frequency 2300 MHz to 2700 MHz)
- Integrated temperature compensation bias
- Independent control of carrier and peaking bias
- Integrated ESD protection
- Source impedance 50 Ω; high power gain
- For RoHS compliance see the product details on the Ampleon website
Applications
- RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base stations in the 2300 MHz to 2700 MHz frequency range
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2300 | 2700 | MHz | ||
| PL(3dB) | nominal output power at 3 dB gain compression | 63 | W | |||
| Test signal: 1-c W-CDMA 5 MHz PAR 9.9 dB | ||||||
| VDS | drain-source voltage | 2500 MHz [0] | 28 | V | ||
| PL(AV) | average output power | 2500 MHz [0] | 10 | W | ||
| Gp | power gain | 2500 MHz [0] | 28.2 | dB | ||
| ηD | drain efficiency | 2500 MHz [0] | 40.8 | % | ||
| PL(M) | peak output power | 2500 MHz [0] | 48.9 | dBm | ||
Package / Packing
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM10D2327-60ABG | OMP-400-8G-1 (OMP-400-8G-1) |
omp-400-8g-1_po | Tray, NonBakeable, Multiple in Drypack | Active | Standard Marking |
BLM10D2327-60ABGZ (9349 602 36517) |
|
| BLM10D2327-60ABGY | OMP-400-8G-1 (OMP-400-8G-1) |
omp-400-8g-1_po | T&R 13" Drypack | Active | Standard Marking |
BLM10D2327-60ABGYZ (9349 602 36535) |
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | VDS1 | drain-source voltage of driver stages |
|
|
| 2 | VGS(P) | gate-source voltage of peaking P | ||
| 3 | VGS(C) | gate-source voltage of carrier C | ||
| 4 | RF_IN | RF input | ||
| 5 | VGS(C) | gate-source voltage of carrier C | ||
| 6 | VGS(P) | gate-source voltage of peaking P | ||
| 7 | VDS1 | drain-source voltage of driver stages | ||
| 8 | RF_OUT/VDS2 | RF output / drain-source voltage of final stages | ||
| flange | GND | RF ground |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| BLM10D2327-60ABG | 9349 602 36517 | BLM10D2327-60ABGZ | DigiKey | Buy | Request samples |
| RFMW | Buy | ||||
| BLM10D2327-60ABGY | 9349 602 36535 | BLM10D2327-60ABGYZ | RFMW | Buy | Not available |
Ordering & availability
| Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
|---|---|---|---|---|---|
| BLM10D2327-60ABG | 9349 602 36517 | BLM10D2327-60ABGZ | DigiKey | Buy | Request samples |
| RFMW | Buy | ||||
| BLM10D2327-60ABGY | 9349 602 36535 | BLM10D2327-60ABGYZ | RFMW | Buy | Not available |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| LDMOS 2-stage integrated Doherty MMIC | Data sheet | 2020-01-09 | |
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
| Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
| Packages for RF power transistors | Leaflet | 2024-10-25 | |
| LDMOS ruggedness reliability | Other type | 2017-03-28 | |
| Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
| LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
| RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLM10D2327-60ABG (Data sheet) | Design support | 2020-01-14 |