BLM6G22-30
Download datasheet This product has been discontinued.Click here for discontinuation information.
BLM6G22-30
Download datasheet
This product has been discontinued.
Click here for discontinuation information.
The replacement is: BLM7G1822S-40PB
The replacement is: BLM7G1822S-40PB
W-CDMA 2100 MHz to 2200 MHz power MMIC
30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 2100 MHz to 2200 MHz. Available in gull wing for surface mount (SOT822-1) or flat lead (SOT834-1).
Features and benefits
- Integrated ESD protection
- Designed for broadband operation (2100 MHz to 2200 MHz)
- Biasing of individual stages is externally accessible
- High power gain
- On-chip matching (input matched to 50 Ohm, output partially matched)
- Integrated temperature compensated bias
- Excellent thermal stability
- Compliant to Directive 2002/95/EC, regarding RoHS
- Small component size, very suitable for PA size reduction
Applications
- base station applications
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 2100 | 2200 | MHz | ||
| PL(3dB) | nominal output power at 3 dB gain compression | 30 | W | |||
| Test signal: 2-c WCDMA | ||||||
| Gp | power gain | PL(AV) = 2 W; VDS = 28 V | 27.5 | 29.5 | 32.5 | dB |
| RLin | input return loss | PL(AV) = 2 W; VDS = 28 V; IDq = 270 mA | -14 | -10 | dB | |
| ηD | drain efficiency | PL(AV) = 2 W; VDS = 28 V; 2100 MHz < f < 2200 MHz; IDq = 270 mA | 7.5 | 9 | % | |
| PL(AV) | average output power | 2 | W | |||
| IMD3 | third-order intermodulation distortion | VDS = 28 V | -48 | -44.5 | dBc | |
| ACPR | adjacent channel power ratio | PL(AV) = 2 W; VDS = 28 V; 2100 MHz < f < 2200 MHz; IDq = 270 mA | -50 | -47 | dB | |
Package / Packing
All type numbers in the table below are discontinued.
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM6G22-30 | HSOP16F (SOT834-1) |
sot834-1_po |
sot834-1_fr
|
Reel 13" Q1/T1 | Withdrawn | Standard Marking |
BLM6G22-30,118 (9340 603 03118) |
| Reel 11¼" Q1/T1 in LargePack | Withdrawn | Standard Marking |
BLM6G22-30,135 (9340 603 03135) |
Discontinuation information
| Type number | Ordering code (12NC) | Last-time buy date | Last-time delivery date | Replacement product | DN Notice | Status | Comments |
|---|---|---|---|---|---|---|---|
| BLM6G22-30 | 9340 603 03118 | 2015-09-30 | 2015-12-31 | BLM7G1822S-40PB | 201412012DN | Full withdrawal | |
| BLM6G22-30 | 9340 603 03135 | 2016-03-31 | 2016-06-30 | BLM7G1822S-40PB | 201506035DN | Full Withdrawal | Replacement: BLM7G1822S-40PB(G) |
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | GND | ground |
|
|
| 2 | VDS1 | first stage drain-source voltage | ||
| 3 | n.c. | not connected | ||
| 4 | n.c. | not connected | ||
| 5 | n.c. | not connected | ||
| 6 | RF_INPUT | RF input | ||
| 7 | n.c. | not connected | ||
| 8 | n.c. | not connected | ||
| 9 | VGS1 | first stage gate-source voltage | ||
| 10 | VGS2 | second stage gate-source voltage | ||
| 11 | GND | ground | ||
| 12 | GND | ground | ||
| 13 | n.c. | not connected | ||
| 14 | RF_OUT/VDS2 | RF output or second stage drain-source voltage | ||
| 15 | n.c. | not connected | ||
| 16 | GND | ground | ||
| flange | RF_GND | RF ground |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| W-CDMA 2100 MHz to 2200 MHz power MMIC | Data sheet | 2015-12-07 | |
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
| Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
| Packages for RF power transistors | Leaflet | 2024-10-25 | |
| LDMOS ruggedness reliability | Other type | 2017-03-28 | |
| Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
| LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
| RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLM6G22-30(G) (Data sheet) | Design support | 2012-02-24 |