BLP8G27-10
Download datasheet This product has been discontinued.Click here for discontinuation information.
BLP8G27-10
Download datasheetPower LDMOS transistor
10 W plastic LDMOS power transistor for base station applications at frequencies from 700 MHz to 2700 MHz.
Features and benefits
- High efficiency
- Excellent ruggedness
- Designed for broadband operation
- Excellent thermal stability
- High power gain
- Integrated ESD protection
- Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS)
Applications
- CDMA
- W-CDMA
- GSM EDGE
- MC-GSM
- LTE
- WiMAX
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 700 | 2700 | MHz | ||
| PL(1dB) | nominal output power at 1 dB gain compression | 10 | W | |||
| Test signal: 2-c W-CDMA | ||||||
| Gp | power gain | VDS = 28 V [0] | 17 | dB | ||
| ηD | drain efficiency | VDS = 28 V [0] | 22 | % | ||
| ACPR5M | adjacent channel power ratio (5 MHz) | VDS = 28 V [0] | -47.3 | dBc | ||
Package / Packing
All type numbers in the table below are discontinued.
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLP8G27-10 | HVSON16 (SOT1371-1) |
sot1371-1_po |
sot1371-1_fr
|
Reel 7" Q1/T1 in Drypack | Discontinued | Standard Marking |
BLP8G27-10Z (9340 689 76515) |
Discontinuation information
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 0 | GND | ground (exposed die pad) |
|
|
| 1 | n.c. | no connection | ||
| 2 | n.c. | not connected | ||
| 3 | G | gate | ||
| 4 | G | gate | ||
| 5 | G | gate | ||
| 6 | G | gate | ||
| 7 | n.c. | not connected | ||
| 8 | n.c. | not connected | ||
| 9 | n.c. | not connected | ||
| 10 | n.c. | not connected | ||
| 11 | D | drain | ||
| 12 | D | drain | ||
| 13 | D | drain | ||
| 14 | D | drain | ||
| 15 | n.c. | not connected | ||
| 16 | n.c. | not connected |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
| Power LDMOS transistor | Data sheet | 2015-12-07 | |
| Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
| Packages for RF power transistors | Leaflet | 2024-10-25 | |
| LDMOS ruggedness reliability | Other type | 2017-03-28 | |
| Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
| LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
| RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLP8G27-10 (Data sheet) | Design support | 2015-07-17 | |
| Model Library for Cadence AWR Microwave Office® | Simulation model | 2023-01-02 | |
| Model Library Manual for Cadence AWR Microwave Office® | Simulation model | 2023-01-02 | |
| Simulation Example for Cadence AWR Microwave Office® | Simulation model | 2023-01-02 | |
| BLP8G27-10 Model for ADS (Keysight Advanced Design System) | Simulation model | 2017-04-19 |