BLM6G10-30G
Download datasheet This product has been discontinued.Click here for discontinuation information.
BLM6G10-30G
Download datasheetW-CDMA 860 MHz to 960 MHz power MMIC
30 W LDMOS 2-stage power MMIC for base station applications at frequencies from 860 MHz to 960 MHz. Available in Gull Wing for surface mount (SOT822-1) or flat lead (SOT834-1)
Features and benefits
- Integrated temperature compensated bias
- Excellent thermal stability
- Biasing of individual stages is externally accessible
- Integrated ESD protection
- Small component size, very suitable for PA size reduction
- On-chip matching (input matched to 50 Ohm, output partially matched)
- High power gain
- Designed for broadband operation (860 MHz to 960 MHz)
Applications
- Driver for Base Station applications
Parametrics
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| frange | frequency range | 860 | 960 | MHz | ||
| PL(3dB) | nominal output power at 3 dB gain compression | 30 | W | |||
| Test signal: 2-c WCDMA | ||||||
| Gp | power gain | PL(AV) = 2 W; VDS = 28 V | 27 | 29 | 31 | dB |
| RLin | input return loss | VDS = 28 V | -15 | -12 | dB | |
| ηD | drain efficiency | VDS = 28 V | 10 | 11.5 | % | |
| PL(AV) | average output power | 2 | W | |||
| IMD3 | third-order intermodulation distortion | VDS = 28 V | -48.5 | -45 | dBc | |
| ACPR | adjacent channel power ratio | PL(AV) = 2 W; VDS = 28 V; IDq = 105 mA | -52 | -48.5 | dBc | |
Package / Packing
All type numbers in the table below are discontinued.
| Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| BLM6G10-30G | HSOP16 (SOT822-1) |
sot822-1_po |
sot822-1_fr
|
Reel 13" Q1/T1 | Withdrawn | Standard Marking |
BLM6G10-30G,118 (9340 608 93118) |
| Horizontal, Rail Pack | Withdrawn | Standard Marking |
BLM6G10-30G,127 (9340 608 93127) |
Discontinuation information
Pinning info
| Pin | Symbol | Description | Simplified outline | Graphic symbol |
|---|---|---|---|---|
| 1 | GND | GROUND |
|
|
| 2 | VDS1 | VDS1 | ||
| 3 | n.c. | no connection | ||
| 4 | n.c. | no connection | ||
| 5 | n.c. | no connection | ||
| 6 | RF_INPUT | RF_INPUT | ||
| 7 | n.c. | no connection | ||
| 8 | VGS1 | VGS1 | ||
| 9 | VGS2 | VGS2 | ||
| 10 | VDS1 | VDS1 | ||
| 11 | GND | GROUND | ||
| 12 | GND | GROUND | ||
| 13 | n.c. | no connection | ||
| 14 | RF_OUTPUT/VDS2 | RF_OUTPUT/VDS2 | ||
| 15 | n.c. | no connection | ||
| 16 | GND | GROUND | ||
| flange | RF_GROUND | RF_GROUND |
Documentation
| Title | Type | Date | |
|---|---|---|---|
| W-CDMA 860 MHz - 960 MHz power MMIC | Data sheet | 2015-12-07 | |
| Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
| Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
| Packages for RF power transistors | Leaflet | 2024-10-25 | |
| LDMOS ruggedness reliability | Other type | 2017-03-28 | |
| Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
| LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
| RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
| Title | Type | Date | |
|---|---|---|---|
| Printed-Circuit Board (PCB) BLM6G10-30(G) (Data sheet) | Design support | 2012-02-24 |