B11G3338N81D
Download datasheetB11G3338N81D
Download datasheetLDMOS 3-stage integrated Doherty MMIC
The B11G3338N81D is a dual section 3-stage fully integrated Doherty MMIC solution using Ampleon's state of the art LDMOS technology. The carrier and peaking device, input splitter, output combiner and pre-match are integrated in each section. This multiband device is perfectly suited as general purpose driver in the frequency range 3300 MHz to 3800 MHz. Available in PQFN outline.
Features and benefits
- Integrated input splitter
- Integrated output combiner
- 25 Ω output impedance thanks to integrated pre-match
- Designed for large RF and instantaneous bandwidth operation
- High linearity
- Independent control of carrier and peaking bias
- Integrated ESD protection
- Integrated bias gate switch
- Source impedance 50 Ω; high power gain
- For RoHS compliance see the product details on the Ampleon website
Applications
- Macrocell base station driver
- Microcell base station
- 5G mMIMO
- W-CDMA/LTE
- Active antenna
- General purpose applications
Parametrics
Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
---|---|---|---|---|---|---|
frange | frequency range | 3300 | 3800 | MHz | ||
PL(3dB) | nominal output power at 3 dB gain compression | 75 | W | |||
Test signal: Pulsed CW | ||||||
VDS | drain-source voltage | [0] [1] | 28 | V | ||
Gp | power gain | PL = 5 W (37 dBm) [0] [1] | 31 | 34 | 38 | dB |
ηD | drain efficiency | PL = PL(3dB) [0] [1] | 30 | 40 | % | |
ηD | drain efficiency | PL = 5 W (37 dBm) [0] [1] | 18 | 25 | % | |
RLin | input return loss | [0] [1] | -15 | -10 | dB |
Package / Packing
Type number | Package | Outline version | Reflow-/Wave soldering |
Packing | Product status | Marking |
Orderable part number, (Ordering code (12NC)) |
---|---|---|---|---|---|---|---|
B11G3338N81D | PQFN 12x7 (PQFN-12x7-36-1) |
pqfn-12x7-36-1_po | TR13; 1500-fold; 24 mm; dry pack | Active | Standard Marking |
B11G3338N81DX (9349 606 38525) |
|
TR7; 300-fold; 24 mm; dry pack | Active | Standard Marking |
B11G3338N81DYZ (9349 606 38535) |
Pinning info
Pin | Symbol | Description | Simplified outline | Graphic symbol |
---|---|---|---|---|
1 | GND | ground | ||
2 | VDS2_A/decoupling | drain-source voltage of final stages of section A | ||
3 | c.t.g. | connect to ground | ||
4 | VGS(carr) | gate-source voltage of carrier | ||
5 | VGS(peak) | gate-source voltage of peaking | ||
6 | VDS1_A | drain-source voltage of driver stages of section A | ||
7 | GND | ground | ||
8 | n.c. | not connected | ||
9 | PA_e | PA enable trigger signal, 0 V to 5 V, IDq-bias ON/OFF corresponds to logic HIGH/LOW | ||
10 | VDD(5V) | supply voltage (5 V) | ||
11 | GND | ground | ||
12 | RF_IN_A | RF input of section A | ||
13 | GND | ground | ||
14 | RF_IN_B | RF input of section B | ||
15 | GND | ground | ||
16 | VDD(5V) | supply voltage (5 V) | ||
17 | PA_e | PA enable trigger signal, 0 V to 5 V, IDq-bias ON/OFF corresponds to logic HIGH/LOW | ||
18 | n.c. | not connected | ||
19 | GND | ground | ||
20 | VDS1_B | drain-source voltage of driver stages of section B | ||
21 | VGS(peak) | gate-source voltage of peaking | ||
22 | VGS(carr) | gate-source voltage of carrier | ||
23 | c.t.g. | connect to ground | ||
24 | VDS2_B/decoupling | drain-source voltage of final stages of section B | ||
25 | GND | ground | ||
26, 27, 28, 29, 30 | RF_OUT_B | RF output of section B | ||
31 | GND | ground | ||
32, 33, 34, 35, 36 | RF_OUT_A | RF output of section A |
Ordering & availability
Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
---|---|---|---|---|---|
B11G3338N81D | 9349 606 38525 | B11G3338N81DX | DigiKey | Buy | Not available |
RFMW | Buy | ||||
B11G3338N81D | 9349 606 38535 | B11G3338N81DYZ | DigiKey | Buy | Request samples |
RFMW | Buy |
Ordering & availability
Type number | Ordering code (12NC) | Orderable part number | Distributor | Buy online | Samples |
---|---|---|---|---|---|
B11G3338N81D | 9349 606 38525 | B11G3338N81DX | DigiKey | Buy | Not available |
RFMW | Buy | ||||
B11G3338N81D | 9349 606 38535 | B11G3338N81DYZ | DigiKey | Buy | Request samples |
RFMW | Buy |
Documentation
Title | Type | Date | |
---|---|---|---|
Mounting and soldering of RF transistors in overmolded plastic packages | Application note | 2023-07-24 | |
LDMOS 3-stage integrated Doherty MMIC | Data sheet | 2022-11-14 | |
Mounting and soldering of RF transistors in air cavity packages | Application note | 2024-05-23 | |
Packages for RF power transistors | Leaflet | 2024-10-25 | |
LDMOS ruggedness reliability | Other type | 2017-03-28 | |
Efficiency improvement of LDMOS transistors for base stations: towards the theoretical limit | Other type | 2017-05-02 | |
LDMOS technology for RF power amplifiers | Other type | 2017-05-03 | |
RF power solutions for Wireless Infrastructure | Brochure | 2024-10-08 |
Design support
Title | Type | Date | |
---|---|---|---|
Printed-Circuit Board (PCB) B11G3338N81D (Data sheet) | Design support | 2023-02-10 |